Day 1 (5 JULY 2012)

Assalamualaikum and Salam Sejahtera....

First of all,  I would like to thank a lot to Mr. Siva and Mr. Mazran because have been willing to give me an opportunity to complete my industrial training period that remaining at 8 weeks at HIIS (Hitech Integrated Innovation Solution Sdn.Bhd) or known as UTeM Holdings  after I had to change the location of industrial training because of a few problem in the previous company.

After submitting a letter of resignation to the Ranger Communication on Wednesday, I had to report to Mr. Mazran on Thursday. After thinking carefully and make comparison with previous company, I am pretty sure that I can get many benefit and learn more from this company.

After complete registration process and get a simple briefing from Mr. Mazran, we have been instructed to setup a workplace that we will use as our training room during the training industry. We have chose as a tutorial rooms as our workstation and we have prepared all the equipment such as desks, fans and soldering equipment.

After that, I was briefed by Mr. Siva a little bit about electronic components. Mr. Siva said that as a engineer, we should be very familiar with electronic compenent. He also emphasized  the importance of basic knowledge of electronics .

There are two categories of electronic components:

i- Surface Mount Devices (SMD)

ii-Through-Hole Technology

Surface Mount Devices (SMD)

Surface-mount technology (SMT) is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). SMDs have improved performance over through-hole components due to their smaller size, shorter internal leads, and smaller board layouts. These factors reduce the circuit’s parasitic inductance and capacitance. SMDs can also be more cost effective than traditional through-hole components due to the smaller board size, fewer board layers, and fewer holes. SMDs can also be easier to replace than through-hole components on multilayer boards.

Example of SMD components

Through-Hole Technology

A through-hole technology are refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by manual assembly by hand placement or by the use of automated insertion mount machines.

Example of Through Hole component

Mr. Siva also teach basically  how to read the labels on  components, how to differentiate types of component where all labels that attached on the electronic components have the their own meanings. So, as a engineer we should know what’s the meaning of each label. For example, he has teach us about relay. Basic relay has 4 legs that is for common terminal, contact terminal( normally closed and normally open) and Vcc. On relay, there are a few label shown.

Left Side- used in our country and neighbouring region

7A  240 VAC- means that this relay can operate on 240V AC with a maximum current 7A

10A 28VDC- in 28VDC, this relay can operate with a maximum current 10A.

Right Side- used for another country such as Japan

10A 125VAC- means that this relay can operate on 125V AC with a maximum current 10A

10A 28VDC- in 28VDC, this relay can operate with a maximum current 10A.

Lower Side-

SRD-12VDC-SL-C  - the core value are 12VDC